Microforming technology
The fast growing market in micro-technology also requires the implementation of smaller and smaller products within punching and forming technology. We have accepted this challenge and have successfully implemented projects within the microforming technology sector together with our clients. Through a tight dovetailing of product and tool design it is possible to achieve the safe forming of even the smallest of dimensions with the aid of high-precision tools. This even includes material thicknesses of a few hundredths of a millimetre.
contact element
; "AT_Massefeder")
contact element on metal foil basis
material: 50μm 1.4310
working temperatur: up to 300°C
mountable with reflow soldering process
suitable for pick-and-place assembly
wafer element
; "AT_Waferfeder")
contact element on metal foil basis
dimensions LxBxH: 1x1x0,8mm
material: 30μm CuBe2
elastic range of spring 0,2mm
mountable with reflow soldering process
suitable for pick-and-place assembly