MID precision injection moulding technology

MID (=Moulded Interconnect Device) technology allows injection-moulded plastic parts to be mounted on printed circuit board tracks. There are various methods for achieving this, such as laser-direct structuring or 2 shot moulding. With both these methods, maximum standards need to be met in terms of moulding points, absence of burrs, warping, tolerances and surface properties. As an active member of the MID research association, we are well aware of the special rheological properties required in the high-performance plastics used with this technology, and we have developed special expertise in this area in recent years. We can manufacture tools that are capable of meeting these specialised high requirements for you.

2-shot MID demonstrator

example 2-shot-MID demonstrator

MIC module

MID component with 3-dimensionally arranged circuit board structure
Mounting for several miniature microphones
dimensions LxBxH: 16,4x3,6x1,5
material: LCP
weight of components: 0,074g
application: medical technology

SMI-Kompass

MID component with 3-dimensionally arranged circuit board structure
dimensions LxBxH: 5x4x1,7mm
material: LCP
weight of components: 0,044g
application: telecommunications

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